Microprocessor Logic
Evry day we use computer and we can't do a job withouth computer, but did you know how does processor/ microprocessor work.??.To understand how a microprocessor works, it is helpful to look inside and learn about the logic used to create one. In the process you can also learn about assembly language -- the native language of a microprocessor -- and many of the things that engineers can do to boost the speed of a processor.
A microprocessor executes a collection of machine instructions that tell the processor what to do. Based on the instructions, a microprocessor does three basic things
Using its ALU (Arithmetic/Logic Unit), a microprocessor can perform mathematical operations like addition, subtraction, multiplication and division. Modern microprocessors contain complete floating point processors that can perform extremely sophisticated operations on large floating point numbers.
A microprocessor can move data from one memory location to another.
A microprocessor can make decisions and jump to a new set of instructions based on those decisions.
There may be very sophisticated things that a microprocessor does, but those are its three basic activities. The following diagram shows an extremely simple microprocessor capable of doing those three things:
This is about as simple as a microprocessor gets. This microprocessor has:
An address bus (that may be 8, 16 or 32 bits wide) that sends an address to memory
A data bus (that may be 8, 16 or 32 bits wide) that can send data to memory or receive data from memory
An RD (read) and WR (write) line to tell the memory whether it wants to set or get the addressed location
A clock line that lets a clock pulse sequence the processor
A reset line that resets the program counter to zero (or whatever) and restarts execution
Let's assume that both the address and data buses are 8 bits wide in this example.
Here are the components of this simple microprocessor:
Registers A, B and C are simply latches made out of flip-flops. (See the section on "edge-triggered latches" in How Boolean Logic Works for details.)
The address latch is just like registers A, B and C.
The program counter is a latch with the extra ability to increment by 1 when told to do so, and also to reset to zero when told to do so.
The ALU could be as simple as an 8-bit adder (see the section on adders in How Boolean Logic Works for details), or it might be able to add, subtract, multiply and divide 8-bit values. Let's assume the latter here.
The test register is a special latch that can hold values from comparisons performed in the ALU. An ALU can normally compare two numbers and determine if they are equal, if one is greater than the other, etc. The test register can also normally hold a carry bit from the last stage of the adder. It stores these values in flip-flops and then the instruction decoder can use the values to make decisions.
There are six boxes marked "3-State" in the diagram. These are tri-state buffers. A tri-state buffer can pass a 1, a 0 or it can essentially disconnect its output (imagine a switch that totally disconnects the output line from the wire that the output is heading toward). A tri-state buffer allows multiple outputs to connect to a wire, but only one of them to actually drive a 1 or a 0 onto the line.
The instruction register and instruction decoder are responsible for controlling all of the other components.
Although they are not shown in this diagram, there would be control lines from the instruction decoder that would:
Tell the A register to latch the value currently on the data bus
Tell the B register to latch the value currently on the data bus
Tell the C register to latch the value currently output by the ALU
Tell the program counter register to latch the value currently on the data bus
Tell the address register to latch the value currently on the data bus
Tell the instruction register to latch the value currently on the data bus
Tell the program counter to increment
Tell the program counter to reset to zero
Activate any of the six tri-state buffers (six separate lines)
Tell the ALU what operation to perform
Tell the test register to latch the ALU's test bits
Activate the RD line
Activate the WR line
Coming into the instruction decoder are the bits from the test register and the clock line, as well as the bits from the instruction register.
How To Make Procesors..??
Sand, a quarter portion is formed from silicon, which is the mostabundant chemical element on earth after oxygen. Sand (mainlyquartz), has a high percentage of silicon in the form of SiliconDioxide (SiO2) and the sand is the main material for producingsemiconductor.
After obtaining mentahan of sand and separates the silicone, theexcess material removed. Then, purified silicon gradually until it reaches the quality of 'semiconductor manufacturing quality', or so-called 'electronic grade silicon'. Purification resulted in somethingso terrible that 'electronic grade silicon' may only have one 'alienatoms' in each one billion atoms of silicon. After the purification stepis complete silicon, silicon smelting phase. From the picture above,we can see how the large-sized crystals of silicon appear merged.The result is a single crystal, called 'Ingot'.
Single crystal 'Ingot' is formed from the 'electronic grade silicon'. Bigone 'Ingot' approximately 100 Kilograms or 220 pounds, and has a high purity silicon up to 99.9999 percent.
After that, 'Ingot' entering the incision. 'Ingot' in thin slices to produce'silicon discs', which is called the 'wafers'.
Some 'Ingot' can stand up to 5 feet. 'Ingot' also has a different diameter depending on how big the size of the 'wafers' are required.
CPU time is now usually require'wafers' with a size of 300 mm.
Once sliced, 'wafers' polished until completely smooth, perfect,mirror-like surface into a very, very smooth. In fact, Intel did notproduce its own 'Ingots' and 'wafers', but Intel to buy from companies'third-party'. Processor Intel with 45nm technology, using 'wafers'with size 300mm (12 inch), whereas the first time Intel makes chips, Intel is using 'wafers' to the size of 50mm (2 inch).
Blue liquid as seen in the picture above, is 'Photo Resist' as used in the 'Film' in photography. 'wafers' are played in this stage so thatlayers can be uniformly smooth and thin.
In this phase, 'Photo Resist' lit 'Ultra Violet'. Chemical reactions thatoccur in this process is similar to 'film' camera happens when wepress the shutter (Jepret!).
The strongest area or stand in the 'wafer' to be flexible and fragiledue to the effects of the rays 'Ultra Violet'. Lighting to be managedby using protective function like a stencil. When exposed to light'Ultra Violet', a protective layer made of circuit patterns. In themanufacture of processors, is very important and key to repeat thisprocess repeated until the layers above the bottom layer, and so on.
The lens in the middle serves to shrink the light into a small focus.
From the picture above, we can picture what if one fruit 'Transistor'we see with the naked eye. Transistor functioning as a switch,controlling the flow of electric current in the 'Chip' computers. Intel researchers have developed a transistor becomes so small thatabout 30 million 'Transistor' can be lodged at the end of the 'Pin'.
Once exposed to light 'Ultra Violet', the 'Photo Resist' absolutelydevastated.
The picture above reveal patterns 'Photo Resist'created by the protective layer.
This pattern is the beginning of'transistors', 'interconnects', and matters relating to electricity beginsfrom here.
Although the fields were destroyed, a layer of 'Photo Resist' stillprotect material 'Wafer' so it will not tersketsa. The part that is notprotected will be sketched with chemicals.
After tersketsa, layer 'Photo Resist' is removed and the desired shape to be visible.
'Photo Resist' re-used and illuminated with light 'Ultra Violet'. 'PhotoResist' which tersinari then washed first before stepping into the next stage, the washing process is called 'Ion Doping', the process by which ion particle ditabrakan to 'Wafers', so that the chemicalproperties of silicon was changed, so the CPU can control theelectrical current.
Through a process called 'ion implantation' (part of the process ofion doped) silicon area on the 'wafers' were shot by the ions. Ionsimplanted in silicon in order to change between silicon withelectrical power. Ion driven to the surface 'Wafer' with high speed.Electric fields accelerate ions with a speed of more than 300,000km / h (about 185.000 mph)
After ion implanted, 'Photo Resist' is removed, and green coloredmaterial that is now embedded in the picture 'Alien Atoms'
This transistor is almost complete. Three holes have been tersketsain insulating layer (reddish purple), which is above the transistor.Three holes will be filled with copper, which serves to connect thetransistors with other transistors.
This transistor is Almost complete. Three holes have been tersketsain the insulating layer (reddish purple),
the which is above thetransistor. Three holes will of be filled with copper,
the which servesto the connect the transistors with other transistors.
Copper ions has become a thin layer on the surface of the 'wafers'.
Mashed excess material, leaving a very thin layer of copper.
Well have started ribet. Much is made of metal layers tointerconnect the various transistors. How is this connected series ofrelationships, it is determined by the technical architecture anddesign team that developed the capabilities of each processor.Where computer chips look very flat, it actually has more than 20layers to create complex circuits. If you look with a magnifying glass,you will see a complex network of circuits and transistors that looksfuturistic, 'Multi-Layered Highway System'.
This is just a super small sample of the 'wafer' that will go throughthe first stage of testing capabilities. At this stage, a test pattern is sent to each chip, then the response of the chip will be monitoredand compared with 'The Right Answer. "
After test results showed that the 'wafer' pass, 'Wafer' is cut into asection called 'Dies'. Try the skipper can see, the process was really complicated, but the result was small talaga. In the leftmostimage that there are 6 groups 'Wafers', on his right image alreadyhow 'Wafer' tuh!?!?
'Dies' which passed the test, will be included into the next stage of'Packaging'. 'Dies' which does not pass, thrown by percumanyaT_T. There's a funny thing a few years ago, Intel made the key of'Dies' which did not pass it ^ ^. There EBAYnya you know, let'sskipper who are interested in purchasing, becauselive 4 ..
This is a picture of the 'Die', which had been cut in previousprocesses. 'Die' in this picture is 'Die' from the Intel Core i7Processor.
Undercoat, 'Die', and 'heatspreader' fitted together to form a'Processor'. Green layer below, is used to form electrical and'Mechanical Interface' for the processor in order to interact with a PC system. 'heatspreader' is 'Thermal Interface' in which the cooling solution is applied, so that the processor can remain cool inoperation.
'microprocessor' is the product terkompleks in this world. In fact, tomake it require hundreds of stages and which we described earlieris just that important.
During the last test for the Processor, Processor in testcharacteristics, such as the use of power and its maximumfrequency.
Based on previous test results, grouped by Processor Processorwhich has a similar capability. This process is called the 'Binning','Binning' determined from the maximum frequency processor, and then stack Processor divided and sold in accordance with thespecification stable.
Processor that has been packaged and tested, go to the factory (egfor using that Toshiba laptop) or retail sale (eg at a computer store)
